Heating Elements Based on Thick-Film Technology

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Kolektor Microtel ceramic and steel heating elements support applications requiring compact heating functions, controlled thermal behavior and possible integration with ceramic substrates, thick-film technologies, electronics or custom assemblies.

Ceramic heating elements

Ceramic heating elements

Choose this solution when your application requires a compact heating function, stable thermal behavior and possible integration with ceramic or thick-film technologies.
The heating element can be evaluated as a dedicated component or as part of a broader electronic or mechanical assembly.

Ceramic heating element based on thick-film technology.

Ceramic custom heating solutions

Choose custom heating solutions when the application requires dedicated dimensions, geometry, heating profile, electrical interface, validation, calibration or testing.

Ceramic heating element automated production.

Start from the thermal function, then define the integration path.

Which heating solution fits your application?

  • Choose Ceramic Heating Elements whenyour application requires compact heating, controlled thermal behavior or a heating function based on ceramic and thick-film technologies.
  • Choose Custom Heating Solutions whenthe application requires dedicated geometry, specific thermal behavior, electrical interfaces, validation or application-specific testing.

Need help evaluating a ceramic heating element application?

If you are not sure which heating solution fits your application, send the available thermal, mechanical and electrical requirements. The engineering team can support the evaluation of the most suitable heating element concept and customization path.

Frequently Asked Questions - Heating elements

Got a question? Find our FAQs here. If your question hasn't been answered here, drop us a line or use our contact form .

Ceramic / stainless steel heating elements are used when an application requires compact heating, controlled thermal behavior and possible integration with ceramic substrates, thick-film technologies or electronic assemblies.

Yes. Custom heating solutions can be evaluated when the application requires dedicated dimensions, geometry, electrical interfaces, thermal behavior, validation or testing.

Useful information includes application, target temperature, thermal profile, heating power if known, geometry, substrate constraints, electrical interface, expected volumes and validation requirements.