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From concept to reliable industrial production
At Kolektor Microtel, Electronic Manufacturing Services mean more than assembling electronic components. We provide a comprehensive portfolio of technologies and manufacturing capabilities designed to support customers throughout the production process, from industrialization and assembly to protection, testing and final inspection.
Our experience in both PCBA manufacturing and thick-film ceramic technology enables us to manage highly specialized electronic projects and provide integrated solutions tailored to demanding industrial applications.
Advanced PCBA assembly capabilities
Our production facilities combine automated processes, precision equipment and flexible manufacturing solutions. Our assembly capabilities include high-performance SMT lines with nitrogen reflow ovens, processing of miniaturized 01005 components, laser marking and substrate serialization, solder paste inspection, automated optical inspection and AXI inspection.
Laminar and selective wave soldering, robotic soldering and dedicated handling systems allow us to address different product configurations, production volumes and application requirements.
Protection for demanding operating environments
Electronic assemblies often need to withstand moisture, chemicals, vibration, temperature changes and other challenging environmental conditions. For this reason, our EMS portfolio includes automated conformal coating, glue and solder paste dispensing, bi-component resin dispensing and robotic encapsulation processes.
These technologies help protect electronic circuits while supporting consistent application quality and repeatable industrial production.
Testing and quality control
Reliability is built into every stage of our manufacturing process. We develop testing procedures and dedicated equipment according to customer specifications, combining electrical, functional, thermal and visual controls.
Our capabilities include Flying Probe and Bed of Nails in-circuit testing, functional testing, high-voltage insulation testing, power testing, thermal shock cycles, burn-in and offline X-ray inspection. This broad range of controls helps detect potential defects and verify product performance before delivery.
Bonding, packaging and semiconductor integration
Kolektor Microtel also provides advanced bonding and packaging processes, including high-speed automatic gold-wire thermosonic ball bonding, bare-die encapsulation and mechanical pull and shear testing.
Fine and gross leak hermeticity testing can also be performed for applications requiring controlled packaging integrity. These capabilities extend our EMS offering beyond conventional PCB assembly and support the manufacture of compact, highly integrated electronic solutions.
Thick-film ceramic technology under one roof
A distinctive strength of Kolektor Microtel is the integration of conventional electronics manufacturing with thick-film ceramic processing.
Our ceramic capabilities include automatic and manual thick-film production lines, ISO 6 and ISO 7 cleanrooms, robotic handling systems and laser equipment for active and passive trimming. This combination of electronics and ceramic expertise enables us to manufacture hybrid circuits, sensing elements, heating solutions and other customized ceramic-based components.
One EMS partner, multiple technologies
By combining PCBA assembly, protection, testing, bonding, packaging and ceramic technologies, Kolektor Microtel offers customers a coordinated manufacturing approach within a single technology partner.
Whether the project involves a miniaturized IoT board, an industrial electronic assembly, a hybrid circuit or a ceramic sensing and heating solution, our goal is the same: turning complex product requirements into reliable and scalable manufacturing processes.
Discover our EMS portfolio and contact Kolektor Microtel to discuss your next electronic manufacturing project.